mmRA-20Jetson AGX Orin robotics AI compute board
Integrates up to 275 TOPS of compute, M.2 AI-accelerator expansion (DeepX, Hailo), and the broad connectivity robotics needs — 5x CAN, multiple USB, and GbE — onto a single board. An on-board STM32G474 MCU plus power-monitoring, IMU, and pressure sensors drive a robot system without an external controller.
- Jetson AGX Orin64GB· Compute module
- Up to 275 TOPS· AI performance
- 699-pinMolex 2034560003· Module socket
- x2NVMe or AI accelerator· M.2 KEY-M
Top — AGX Orin 699-pin socket · USB 3.0 x6 · 1 GbE · HDMI · USB-PD
Technical specifications
Jetson AGX Orin compute, robotics connectivity, and on-board sensors/MCU consolidated onto a single board.
| Compute module | Jetson AGX Orin64GB |
|---|---|
| AI performance | Up to 275 TOPS |
| Module socket | 699-pinMolex 2034560003 |
| M.2 KEY-M | x2NVMe or AI accelerator |
|---|---|
| Accelerators | DeepX · HailoLow-power AI compute |
| SD card | x1 |
| USB 3.0 | x63 left · 3 right |
|---|---|
| USB recovery | x1Recovery |
| USB 2.0 | x2Custom connector |
| Ethernet | 1 GbERJ-45 |
| Display | HDMI out x1 |
| CAN bus | 5 chOn-board CAN0 · CAN1 · CAN4 + 2 via extension |
| CAN controller | MCP2518FDCAN FD |
| UART | x13.3V |
| PWM out | x2 |
| Expansion connector | 64-pinBA51-64CT-1-UHB |
| M.2 KEY-E | x1WiFi / BT |
| On-board MCU | STM32G474Real-time control |
|---|---|
| Inertial sensor | LSM6DSR6-axis IMU |
| Barometer | BMP388 |
| Power monitoring | Yes |
| System control | nFORCE_RECOVERY · nSYS_RESET |
| Fan header | x1 |
| Audio | MIC · Speaker |
| External power input | 20 VDedicated connector |
|---|---|
| USB-PD | x1 |
| Extension board input | 20–60 VWide range · B2B connector |
| Board size | 110 × 136.5 mm |
|---|---|
| Form factor | Carrier boardJetson AGX Orin socket |
Key features
Up to 275 TOPS inference
The Jetson AGX Orin 64GB runs large vision-language-action and imitation-learning models on the edge in real time, without cloud dependency.
M.2 AI-accelerator expansion
Two M.2 KEY-M slots add low-power AI accelerators such as DeepX or Hailo, or NVMe storage, to match the workload.
Integrated robotics connectivity
5x CAN, 6x USB 3.0, GbE, and UART on a single board connect multi-axis actuators and sensors without a separate hub.
On-board MCU and sensors
An STM32G474 MCU with power monitoring, IMU, and barometer is integrated on-board, handling navigation, balance, and safety control without extra modules.
Board composition
Compute, expansion slots, MCU/sensors, and power are integrated on one board, so a robot system runs without external controllers.
Jetson AGX Orin compute
A socketed 64GB module delivers up to 275 TOPS of high-performance AI compute.
M.2 expansion slots
One KEY-E (WiFi/BT) and two KEY-M (NVMe or AI accelerator) slots flexibly expand storage, wireless, and accelerators.
STM32G474 MCU · integrated sensors
A real-time control MCU plus power monitoring, IMU, barometer, LED, and switch are built into the board for low-level control.
Wide-range power · extension board
A DC 20–60V wide input is supported through an extension board over a board-to-board connector, covering varied power environments.
Board layout
Top-side AGX Orin socket and I/O placement, the M.2 expansion slots and CAN ports on the underside, and the outline dimensions. Full drawings are available in the downloads below.
Applications
For humanoid, mobility, and research systems that need high-performance on-device inference.
Humanoids · robot arms
Serves as the on-board AI compute for dual-arm humanoids such as BELLO and for robot arms.
High-performance mobile platforms
Acts as the brain of mobile robot platforms that require multi-sensor fusion and large-model inference.
VLA · imitation-learning inference
Up to 275 TOPS runs VLA and imitation-learning models on the edge in real time.
R&D · prototyping bed
Rich connectivity and expansion slots make it a bed for robotics research and prototyping.
Downloads
Hardware drawings and a 3D model file are available.
3D STEP model
ZIPmmRA-20 deployment evaluation
MOTOMIND supports board specs review, customization, and production collaboration.